Set-Na.com
Title
SET Assembly and Packaging Equipment, Nanoimprint Lithography Tools
Description
Excerpted from the website description:
- S.E.T., Smart Equipment Technology is a world leading supplier of High Accuracy Device Bonders and versatile Nanoimprint Lithography solutions. S.E.T. is the former Device Bonder Division of SUSS MicroTec. As a Supplier of semiconductor equipment dedicated to high precision applications for over 30 years and with an installed base of more than 250 Device Bonders worldwide, S.E.T. is globally renowned for the unsurpassed accuracy and the flexibility of its flip chip bonders.
Languages
English
Additional Information
Related Domains
External Links
- Alexa: Set-Na.com
- WHOIS for Set-Na.com
Categories:
- Set Sas
- Smart Equipment Technology
- SET
- Flip Chip
- Flip Chip Assembly
- Die Bonder
- Device Bonder
- Device Bonding
- Wafer Bonding
- Nanoimprint Lithography
- Hot Embossing
- UV NIL
- FC150
- FC250
- FC300
- LDP150
- NPS300
- Kadett K1
- UV-NIL
- IR-FPA
- MEMS
- Pick And Place
- 3D Packaging
- System In Package
- Die To Die
- Die To Wafer
- Thermosonic Bonding
- IR Sensors
- In Situ Reflow
- Mass Reflow
- Local Reflow
- Joint Shaping
- Bump Shaping
- Semiconductor Equipment
- NIL Tool
- Face-up Alignment
- Passive
- Active Alignment